Semiconductor Tape Solutions
Clean-process adhesive tape for wafer fabrication, chip packaging and semiconductor handling.
Semiconductor Industry Solutions
Our semiconductor-grade tape products support wafer processing, chip packaging, lead frame protection and ESD control.
Key Tape Applications in Semiconductor
4 application scenarios
Wafer Dicing & Backgrinding
Clean-room compatible UV dicing tape and backgrinding tape for wafer thinning and singulation processes.
View Related ProductsChip Packaging & Molding
Heat-resistant polyimide masking tape and die-attach film for IC packaging, encapsulation and molding.
View Related ProductsLead Frame Protection
Precision cover tape for lead frame surface protection during electroplating, etching and transfer molding.
View Related ProductsESD Control & Handling
Anti-static packaging tape, conductive grid tape and ESD-safe handling solutions for sensitive semiconductor parts.
View Related ProductsOur Semiconductor Adhesive Solutions
Our semiconductor-grade tape products support wafer processing, chip packaging, lead frame protection and ESD control.
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